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Professional Manufacturer Pur Based Hot Melt Adhesive For Electronic SubstratesSpecification
Product Name | PUR Based Hot Melt Adhesive for Electronic Substrates |
Material | Solid |
Colour | Yellow |
Size | 30ml |
Glue Type | Hot melt adhesive |
Packing | 30ml/tube |
Storage Temperature | 23~25ºC |
Characteristic | Good adhesiveness and strong bonding for glass and metal. The performances of this single component are neutral curing, no corrosion and easy operation which meet the requirement of RoHS. Superior performances of weather aging resistance, UV resistance,ozone resistance, moisture-proof and waterproof High and low temperature and little changes |
Applied Products | Electronic, Microelectronic |
Service Temperature | Around 110ºC |
Viscosity | 5000 ~ 5300 CPS @ 110 ºC |
Opening time | 20ºC, 90-120s |